產品應用
PRODUCT

Advantage of cheeringsun’s Tiny chip packaging process

• The demand of smaller chip size and electrode are increasing, wire bonding and leadframe are critical processes in packaing procees. Cheeringsun provide the more efficient solution :
  1. eliminating the wire bonding to reduce the cost and time on the process.
  2. special design of the leadframe to fit separate and complicated circuit or electrode.
• Lower chip size is a trend for more function implanted in chip. Tiny chip packaging solution will dominate the tiny chip (< 1 x 0.5 mm) or module ( >4 electrodes) market.